時間:2023年5月17-19日 上海世博展覽館-北門(博成路)
距離展會開幕
北京智聯安科技有限公司
Beijing Mlink Technology Inc
10C31
北京市海淀區北四環西路9號樓8層808
http://www.mlink-tech.cn
北京智聯安科技有限公司由清華校友呂悅川、錢煒先生于2013年9月在北京創辦,十年來堅持通信芯片核心技術全部自研的技術路線,在過去4年內已陸續推出NB-IoT、LTE Cat.1bis、5G RedCap定位芯片等重量級產品,市場表現出色。團隊成員來自高通、華為、展銳、愛立信等國際國內知名通信芯片及設備公司,平均從業年限超15年。公司致力于研發最優秀的廣域蜂窩物聯網通信芯片。
Beijing MLINK Technology Inc. was founded by Tsinghua alumni Lv Yuechuan and Qian Wei in Beijing in September 2013. In ten years, it adhered to the technical route of independent innovation of core technologies. In the past four years, it has successively launched NB-IoT, LTE Cat.1bis, 5G RedCap positioning chips and other heavyweight products, with outstanding market performance. The team members from well-known international and domestic communication chip and equipment companies, such as Qualcomm, Huawei, UNISOC, Ericsson, with an average industry experience of more than 15 years. The company is committed to developing the best wide-area cellular IoT communication chip.
展商邀請函